Ramirez, Jose, Ricardo Yoshioka, Carolina Nunes, Igor Fernandes Namba, and Claudemir Coral.
"Model and simulation of Warpage in packaged IC strips after Mold Array Process." <em>Anais do XXXIII Symposium on Integrated Circuits and Systems Design,
Evento Online, 2020</em>. SBC, 2020,  
pp.222-226.