Organização de um Conjunto de Descobertas Experimentais sobre Causas e Efeitos da Dívida Técnica através de uma Família de Surveys Globalmente Distribuída
Resumo
Conhecer as causas da dívida técnica (DT) pode auxiliar equipes de desenvolvimento a definir ações que podem ser tomadas para evitar a ocorrência de itens de dívida. Identificar os efeitos da DT auxilia análises de impacto e a definir ações corretivas para minimizar possível consequências negativas para o projeto. Nesse contexto, foi criado o projeto InsighTD, uma família de surveys globalmente distribuída. Seu objetivo é investigar o estado da prática sobre DT, incluindo causas que levam à sua ocorrência, efeitos de sua existência e como esses problemas se manifestam no processo de desenvolvimento de software. Respostas de 206 profissionais da indústria de software do Brasil e Estados Unidos foram analisadas. Identificou-se as principais causas da DT, os efeitos de sua presença, e a relação entre modelos de processo e os efeitos da DT. Diagramas probabilísticos de causa e efeito e um mapa conceitual focado em dívida de documentação foram propostos para apoiar a gestão da DT. InsighTD, o primeiro estudo em larga escala da área de DT, também permitiu organizar uma rede de cooperação envolvendo pesquisadores e instituições de 12 países.
Referências
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Griffith, I., Izurieta, C., Taffahi, H. & Claudio, D., A simulation study of practical methods for technical debt management in agile software development, in Proceedings of the 2014 winter simulation conference, Piscataway, NJ, USA, 2014.
Guo, Y., Spínola, R.O., Seaman, C., Exploring the costs of technical debt management – a case study. Empirical Software Engineering Journal. Fator de Impacto(2013 JCR): 1,6400, v.1, p.1 – 24, 2014. https://doi.org/10.1007/s10664-014-9351-7
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Kruchten, P., Nord, R., and Ozkaya, I. “Technical debt: From metaphor to theory and practice,” Software, IEEE, vol. 29, no. 6, pp. 18–21, Nov 2012.
Martini, A., Bosch, J., and Chaudron, M., 2014. Architecture Technical Debt: Understanding Causes and a Qualitative Model. In Proceedings of the 2014 40th EUROMICRO Conference on Software Engineering and Advanced Applications (SEAA '14). IEEE Computer Society, USA, 85-92.
Martini A, Bosch J. On the interest of architectural technical debt: Uncovering the contagious debt phenomenon. J Softw Evol Proc. 2017; e1877.
Nord, R.; Ozkaya, I.; Kruchten, P. & Gonzalez-Rojas, M., In Search of a Metric for Managing Architectural Technical Debt, WICSA/ECSA 2012, IEEE CS, 2012.
Rios, N., de Mendonça Neto, M. G., & Spínola, R. O. (2018). A Tertiary Study on Technical Debt: Types, Management Strategies, Research Trends, and Base Information for Practitioners. Information and Software Technology.
Rios, Nicolli. Organização de um Conjunto de Descobertas Experimentais sobre Causas e Efeitos da Dívida Técnica através de uma Família de Surveys Globalmente Distribuída. 2020. 339p.: il. Tese (Doutorado em Ciência da Computação)-Universidade Federal da Bahia, Salvador, 2020.
Seaman, C. & Guo, Y., Measuring and Monitoring Technical Debt, Advances in. Computers, vol. 82, 2011.
Turner, M., Kitchenham, B., and Brereton, P., “Does the technology acceptance model predict actual use? A systematic literature review,” Information and Software Technology, vol. 52, pp. 463-479, 2010.
Yli-Huumo, J., Maglyas, A., & Smolander, K. (2016). The Effects of Software Process Evolution to Technical Debt—Perceptions from Three Large Software Projects. In Managing Software Process Evolution (pp. 305-327). Springer, Cham.
Yli-Huumo, J., Maglyas, A., Smolander, K. (2015). The benefits and consequences of workarounds in software development projects. In: Fernandes, J.M., Machado, R.J., Wnuk, K. (eds.) ICSOB 2015. LNBIP, vol. 210, pp. 1–16. Springer, Heidelberg (2015). https://doi.org/10.1007/978-3-319-19593-3_1.
Alves, N. S., Mendes, T. S., de Mendonça, M. G., Spínola, R. O., Shull, F., & Seaman, C. (2016). Identification and management of technical debt: A systematic mapping study. Information and Software Technology, 70, 100-121.
Basili, V.R., Caldiera, G., and Rombach, H.D., 1994, “Goal Question Metric Paradigm, Encyclopedia of Software Engineering”, JJ Marciniak.
Besker, T., Martini, A., & Bosch, J. (2018a). Managing architectural technical debt: A unified model and systematic literature review. Journal of Systems and Software, 135, 1–16. https://doi.org/10.1016/j.jss.2017.09.025.
Davis, F.D., “Perceived usefulness, perceived ease of use, and user acceptance of information technology,” MIS Quarterly, 1989. 319-340.
Ernst, N. A., Bellomo, S., Ozkaya, I., Nord, R. L., Gorton, I. (2015). Measure it? Manage it? Ignore it? software practitioners and technical debt. In Proceedings of the 2015 10th Joint Meeting on Foundations of Software Engineering (ESEC/FSE 2015). ACM, New York, NY, USA, 50-60.
Griffith, I., Izurieta, C., Taffahi, H. & Claudio, D., A simulation study of practical methods for technical debt management in agile software development, in Proceedings of the 2014 winter simulation conference, Piscataway, NJ, USA, 2014.
Guo, Y., Spínola, R.O., Seaman, C., Exploring the costs of technical debt management – a case study. Empirical Software Engineering Journal. Fator de Impacto(2013 JCR): 1,6400, v.1, p.1 – 24, 2014. https://doi.org/10.1007/s10664-014-9351-7
Ishikawa, K., “Guide to Quality Control”, Asian Productivity Organization, Tokyo, 1976.
Kalinowski, M., Travassos, G.H. and Card, D.N., “Towards a Defect Prevention Based Process Improvement Approach”, In: Euromicro Conf. on Soft. Eng. and Advanced Applications, pp. 199-206, 2008.
Kruchten, P., Nord, R., and Ozkaya, I. “Technical debt: From metaphor to theory and practice,” Software, IEEE, vol. 29, no. 6, pp. 18–21, Nov 2012.
Martini, A., Bosch, J., and Chaudron, M., 2014. Architecture Technical Debt: Understanding Causes and a Qualitative Model. In Proceedings of the 2014 40th EUROMICRO Conference on Software Engineering and Advanced Applications (SEAA '14). IEEE Computer Society, USA, 85-92.
Martini A, Bosch J. On the interest of architectural technical debt: Uncovering the contagious debt phenomenon. J Softw Evol Proc. 2017; e1877.
Nord, R.; Ozkaya, I.; Kruchten, P. & Gonzalez-Rojas, M., In Search of a Metric for Managing Architectural Technical Debt, WICSA/ECSA 2012, IEEE CS, 2012.
Rios, N., de Mendonça Neto, M. G., & Spínola, R. O. (2018). A Tertiary Study on Technical Debt: Types, Management Strategies, Research Trends, and Base Information for Practitioners. Information and Software Technology.
Rios, Nicolli. Organização de um Conjunto de Descobertas Experimentais sobre Causas e Efeitos da Dívida Técnica através de uma Família de Surveys Globalmente Distribuída. 2020. 339p.: il. Tese (Doutorado em Ciência da Computação)-Universidade Federal da Bahia, Salvador, 2020.
Seaman, C. & Guo, Y., Measuring and Monitoring Technical Debt, Advances in. Computers, vol. 82, 2011.
Turner, M., Kitchenham, B., and Brereton, P., “Does the technology acceptance model predict actual use? A systematic literature review,” Information and Software Technology, vol. 52, pp. 463-479, 2010.
Yli-Huumo, J., Maglyas, A., & Smolander, K. (2016). The Effects of Software Process Evolution to Technical Debt—Perceptions from Three Large Software Projects. In Managing Software Process Evolution (pp. 305-327). Springer, Cham.
Yli-Huumo, J., Maglyas, A., Smolander, K. (2015). The benefits and consequences of workarounds in software development projects. In: Fernandes, J.M., Machado, R.J., Wnuk, K. (eds.) ICSOB 2015. LNBIP, vol. 210, pp. 1–16. Springer, Heidelberg (2015). https://doi.org/10.1007/978-3-319-19593-3_1.
Publicado
27/09/2021
Como Citar
RIOS, Nicolli; SPÍNOLA, Rodrigo; MENDONÇA, Manoel.
Organização de um Conjunto de Descobertas Experimentais sobre Causas e Efeitos da Dívida Técnica através de uma Família de Surveys Globalmente Distribuída. In: CONCURSO DE TESES E DISSERTAÇÕES EM ENGENHARIA DE SOFTWARE (CTD-ES) - CONGRESSO BRASILEIRO DE SOFTWARE: TEORIA E PRÁTICA (CBSOFT), 12. , 2021, Joinville.
Anais [...].
Porto Alegre: Sociedade Brasileira de Computação,
2021
.
p. 80-94.
DOI: https://doi.org/10.5753/cbsoft_estendido.2021.17296.
